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Teledyne Defense Electronics
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Teledyne Advanced Electronic Solutions
/
Processes
Processes
Assembly Cleaning
Automated Optical Inspection
BGA/Device Underfill
Bonding/Coating
Circuit Card Assembly
Component Placement
Material Dispensing
Pin Thru Hole Assembly
Reflow Soldering
Secondary Assembly
Solder Paste
Specialized Rework
X-Ray Inspection
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