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Teledyne e2v HiRel provides microelectronics packaging and products with a full range of packaging solutions from COTS to MIL-PRF-38534 compliant (Class H & K) qualifications.  HiRel provides a one stop solution for your microelectronic assembly, evaluation, test and screening requirements. seabet online casinoOur MCM packaging technology enable our customers to meet size, weight, power and cost (SWaPC) requirements without a sacrifice in performance.   

Our numerous certifications including AS9100, ISO 9001, and MIL-PRF-38534 Class H accreditation, all of which are integral factors in our company-wide initiative to deliver high-reliability microelectronic devices that meet our customers' stringent requirements. We are a DOD Trusted seabet clubSource for Microelectronics Packaging, Assembly, and Test.